Dramatically Improve Exposure Quality and Efficiency
Bringing huge competitive advantages and market opportunities to the exposure machine industry.
Technology Highlights
- High-precision, 365~405 wavelength lightless UV exposure machine optical system;
- Provide efficient, environmentally friendly, customized solutions.
Scope of Application
Wafer-Level Packaging, circuit board layout, circuit board anti-soldering.
 |  |  | |  | |
|---|---|---|---|---|---|
| 規格 | MG1035 | MG1036 | MG1034 (Non-UV) | MG1024/ MG1037(UV) | MG1033 |
| Magnification | 0.8X | 1.5X | 2.4X | 2.4X | 1.68X |
| Pixel Size (Image/Object) | 8.64/10.8 | 25.925/10.8 | 25.925/10.8 | 25.925/10.8 | 22.975/13.68 |
| LED wavelength | 365 / 405 nm | 405nm | 405nm | 365/385/405nm | 365/385/405nm |
| Numerical Aperture, object space(DMD side) | 0.08 | 0.14 | 0.18 | 0.18 | 0.2 |
| Magnification | 0.8 ± 40x10^-6 | 1.5 ± 0.005% | 2.4 ± 0.005% | 2.4 ± 0.005% | 1.68 ± 0.005% |
| Distortion | <0.025% | <0.025% | <0.025% | <0.025% | <0.025% |
| Field Curvature | <13 um (Design value) | <20 um (Design value) | <20 um (Design value) | <20 um (Design value) | <20 um (Design value) |
| Transimission | >80% @405nm | >80% | >80% | >80% | >82%(@405nm) |
| Housing envelope | <= 82 mm | <= 82 mm | <= 82 mm | <= 82 mm | 3.230” +.003/-.000 (82.042 +0.076/-0 mm) maximum diameter |
| Front working distance (mm from object plane-DMD) | >65mm | 65 +0.1/0 (>65 mm) | 65 +0.1/0 (>65 mm) | 65 +0.1/0 (>65 mm) | >65mm |
| Back working distance (mm from image plane) | >50mm | >49 mm | >49 mm | >49 mm | >50mm |
| Total track length (object to image) | <500mm | <500mm | <500mm | <500mm | <500mm |
| TIR Prism Thickness | 42.5mm | 42.5mm | 42.5mm | 42.5mm | 25 mm |